| |
|
型号 |
品牌 |
估价 |
备注 |
| 1. |
|
EDM1-IMX6QP-MSD-BW |
Wandboard |
加载中 ... |
模块化系统 - SOM EDM1 SOM ARM CTX A9 iMX6 QUADPLUS |
| 2. |
|
EDM1-IMX6S-MSD |
Wandboard |
加载中 ... |
模块化系统 - SOM WANDBOARD CORTEX-A9 iMX6 SOLO |
| 3. |
|
EDMHS12M2T2020075KIT |
Wandboard |
加载中 ... |
散热片 EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M + MYLAR |
| 4. |
|
EDMHS12M2T2020150KIT |
Wandboard |
加载中 ... |
散热片 EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7 + MYLAR |
| 5. |
|
PICOHS12M2T2020125KIT |
Wandboard |
加载中 ... |
散热片 PICO HEATSINK + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO OR DUALLITE |
| 6. |
|
PICOHS12M2T2020150KIT |
Wandboard |
加载中 ... |
散热片 PICO HEATSINK + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6 UL/ULL OR I.MX6 QUAD UNLIDDED or I.MX7 |
| 7. |
|
PICO-IMX7-AT |
Wandboard |
加载中 ... |
模块化系统 - SOM PICO-IMX7-AT |
| 8. |
|
PICO-PI-IMX6UL |
Wandboard |
加载中 ... |
开发板和工具包 - ARM PICO-PI-IMX6UL Start Kit Android Things |
| 9. |
|
PICO-PI-IMX6ULL-05G-DEV |
Wandboard |
加载中 ... |
开发板和工具包 - ARM |
| 10. |
|
PICO-PI-IMX7-STARTKIT |
Wandboard |
加载中 ... |
开发板和工具包 - ARM PICO-PI-IMX7-STARTKIT |
| 11. |
|
WBENCLOSURE |
Wandboard |
加载中 ... |
罩类、盒类及壳类产品 WANDBOARD ENCLOSURE |
| 12. |
|
WB-IMX6QP-BW |
Wandboard |
加载中 ... |
开发板和工具包 - ARM WANDBOARD QUAD PLUS KIT |
| 13. |
|
WB-IMX6S-BW |
Wandboard |
加载中 ... |
开发板和工具包 - ARM Wandboard Solo (I.MX6) |
| 14. |
|
WB-IMX6U-BW |
Wandboard |
加载中 ... |
单板计算机 WANDBOARD REV C1 CORTEX-A9 iMX6 DUAL |
